![]() This study focuses solely on electrical performance of laminate and foil combinations, so it does not consider vital mechanical considerations, such as adhesion during processing. Our research focused on emerging PCB materials, so we asked our providers for their best foil, dielectric, and oxide treatment combination that would be next generation, mass-produced after 2024 (in some cases, the dielectric had been in production, but not with this foil smoothness). The PCB and semiconductor package are responsible for the majority of loss in an electrical system, and their performance is a critical consideration for 224 Gb/s/PAM4 signaling. This article explains our methods and results, and points to future work in this area. Our work’s aim was to explore the current state of the art for PCBs and cables, compare them, and assess the technology gap to fully support the insertion loss performance required for higher data rates. Related ResourcesĢ24 Gb/s Per Lane: Options and Challenges PCB manufacturers do continually advance the state of the art to improve their material’s characteristics, most notably roughness from foil and oxide treatment Simultaneously, twinax cable technologies also continue to improve and offer an alternative to PCB transmission lines. However, our initial results revealed that there is some distance to go in PCB development to reach the 1.1dB/inch insertion loss expectations that some standards bodies are considering. Keeping in mind that systems are not shrinking in size, it would be beneficial to keep that same loss per inch as 112 Gb/s just scaled to double the frequency. Recently, in preparation for 224 Gb/s and beyond, our group engaged in a research project to characterize the transmission performance of emerging PCB material sets. Traditionally, transmission lines are traces on a multi-layer printed circuit board (PCB). One of the critical elements to enable these higher data transmission speeds is the transmission line performance. ![]() Anyone in attendance at DesignCon 2023 knows that 224 Gb/s PAM4 signaling is in full development, but there is still some time yet before it is actively deployed.
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